High Performance Grades & Solution

RENY™ Bio-based grade
XH,XL/XJ series

Fig Application image(mobile phones, smartphones, laptops)
Fig Application image(mobile phones, smartphones, laptops)

RENY™ is a composite injection molding material whose main component is PAMXD6 resin. In addition, we have the XH and XL/XJ grades as injection molding materials whose main component is PAXD10 resin which is made from plant-based materials.

Although PAMXD6 resin has a lower water absorption rate than general polyamides, the market has demanded even lower water absorption in terms of dimensional stability, physical property retention, and dielectric property retention. Furthermore, to fully promote crystallization of PAMXD6 resin during injection molding, the mold surface temperature during injection molding must be higher than its for other engineering plastics, making it not easy material for injection molding. PAXD10 resin exhibits even lower water absorption than PAMXD6 resin and superiors in terms of dimensional stability, physical property retention, and dielectric property retention even when absorbing water. It can also be molded at relatively low mold temperatures, improving ease of handling. Furthermore, its lower specific gravity than PAMXD6 resin contributes to weight reduction.

Features of Reny™ XH,XL/XJ series

Low-temp. type ”XL/XJ grade”

While maintaining the good appearance of conventional Reny™, it offers excellent fluidity and high impact resistance. This makes it ideal for thin-walled housing parts requiring strength, rigidity, and a smooth, paintable surface, such as those used in mobile phones, smartphones, and laptops.

High-temp. type “XH grade”

With its high crystallinity, mechanical properties remain stable even after exceeding the glass transition point, maintaining performance across a wide temperature range. Additionally, with a melting point of 290°C, it is suitable for reflow soldering processes in the electrical and electronic fields.

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